GENEVA, Aug. 7 -- PARAGON 28, INC. filed a patent application (US2026/013104) for “INTRAMEDULLARY IMPLANT SYSTEM AND SURGICAL METHOD”. With publication no. WO/2026/165247, here are the other details r... और पढ़ें
GENEVA, Aug. 7 -- OUTDOOR WIRELESS NETWORKS LLC filed a patent application (US2026/013105) for “LINK SHARING IN TDD-DUPLEX MODE”. With publication no. WO/2026/165248, here are the other details relate... और पढ़ें
GENEVA, Aug. 7 -- OUTDOOR WIRELESS NETWORKS LLC filed a patent application (US2026/013097) for “O-RAN IQ SCALING ADJUSTMENT METHODS”. With publication no. WO/2026/165243, here are the other details re... और पढ़ें
GENEVA, Aug. 7 -- APPLE INC. filed a patent application (US2026/013100) for “USER INTERFACES AND TECHNIQUES FOR REPRESENTING INTERACTIONS”. With publication no. WO/2026/165244, here are the other deta... और पढ़ें
GENEVA, Aug. 7 -- STREAMLIGHT, INC. filed a patent application (US2026/013101) for “WORK LIGHT”. With publication no. WO/2026/165245, here are the other details related to the patent application: Ki... और पढ़ें
GENEVA, Aug. 7 -- AIM MEDICAL ROBOTICS INC. filed a patent application (US2026/013091) for “SYSTEM FOR LOCALIZATION OF A SURGICAL INSTRUMENT GUIDE”. With publication no. WO/2026/165240, here are the o... और पढ़ें
GENEVA, Aug. 7 -- UNIVERSAL CITY STUDIOS LLC filed a patent application (US2026/013094) for “SYSTEMS AND METHODS FOR TRACKING AN INTERACTIVE OBJECT VIA HYPERSPECTRAL IMAGING”. With publication no. WO/... और पढ़ें
GENEVA, Aug. 7 -- CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LTD. filed a patent application (US2026/013096) for “BACKSIDE MARKINGS AND MARKING GROOVES FOR WAFER-LEVEL CHIP SCALE PACKAGING DICE”. With p... और पढ़ें
GENEVA, Aug. 7 -- QUALCOMM INCORPORATED filed a patent application (US2026/013087) for “SYSTEM INFORMATION BLOCK TYPE 1 DOWNLINK CHANNEL REPETITION USING A DEPLOYMENT CONFIGURATION”. With publication ... और पढ़ें
GENEVA, Aug. 7 -- APPLE INC. filed a patent application (US2026/013088) for “LOCALIZED AUDIO”. With publication no. WO/2026/165238, here are the other details related to the patent application: Kind... और पढ़ें